Cyient Semiconductor and MIPS collaborate on custom RISC-V power solutions for AI and robotics
NOOR MOHMMED
12/Jun/2025
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Cyient Semiconductor and MIPS collaborate to develop RISC-V-based intelligent power ASICs and ASSPs
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The partnership targets AI power delivery, industrial robotics, data centres, and automotive platforms
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MIPS Atlas IP and Cyient’s mixed-signal design expertise will enable scalable, efficient custom silicon solutions
Hyderabad, India & San Jose, California – June 12, 2025 – In a major development that reflects the convergence of advanced processor IP and custom silicon innovation, Cyient Semiconductors Private Limited, a subsidiary of Cyient Ltd., has announced a strategic partnership with MIPS, a global leader in RISC-V processor IP. The collaboration aims to co-develop application-specific integrated circuits (ASICs) and application-specific standard products (ASSPs) that cater to AI power delivery, industrial robotics, and automotive systems.
The solutions to be developed under this partnership will leverage the MIPS Atlas portfolio of advanced RISC-V processor IP and Cyient’s analog and mixed-signal design capabilities, targeting real-time, safety-critical applications across industrial and high-performance environments.
Strategic Context and Industry Relevance
As global compute platforms scale from cloud to edge, intelligent power delivery has become critical for achieving efficiency and performance. The partnership brings together two complementary strengths:
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MIPS with its high-performance RISC-V microcontrollers and
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Cyient with its domain-optimised design expertise in power delivery and motor control silicon
The collaboration will focus on enabling advanced features such as:
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Real-time control loop compute
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Low latency motor drive control
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Power delivery management
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Programmable safety-critical solutions
All designs will be built around an open, scalable RISC-V foundation, removing vendor lock-ins and offering OEMs and integrators greater flexibility and faster time-to-market.
Leadership Commentary
Suman Narayan, CEO of Cyient Semiconductors, stated:
“As compute systems scale from cloud to the edge, intelligent power delivery is emerging as a key enabler of performance and efficiency. Our collaboration with MIPS allows us to bring together embedded intelligence and advanced power architectures in custom silicon platforms built on a scalable, open foundation. Together, we are designing tomorrow’s semiconductors — purpose-built for a more connected and power-efficient world.”
Sameer Wasson, CEO of MIPS, highlighted:
“The problem of power efficiency and motor control are both real-time compute workloads for which MIPS M8500 microcontrollers are the optimal choice. Building around our best-in-class control-loop performance and efficiency, Cyient brings their unique capability in intelligent power delivery into custom ASIC and ASSP designs to build differentiated solutions that meet customer-specific needs.”
Target Applications and Market Segments
The collaboration aims to deliver cutting-edge silicon solutions for a variety of mission-critical and high-demand applications such as:
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Motor drive control
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Power management for AI systems
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Safety-critical control units in autonomous and electric vehicles
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Data centre power delivery systems
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Industrial automation platforms
With increasing demand for software-defined vehicles, edge AI processing, and intelligent energy systems, this joint initiative positions both companies to address next-generation compute and control requirements.
Technological and Business Advantages
Key benefits for OEMs and system integrators include:
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Access to programmable, scalable silicon solutions
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Reduced development cycle times
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Avoidance of proprietary architecture lock-ins
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Optimised performance-per-watt ratios
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High integration of analog, RF, and digital capabilities
Customers can choose between turnkey ASSP offerings or custom ASIC development, depending on their platform architecture and business model.
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